A new technique which called cutting and axial pushing-grinding process based on crack propagation of plane Silicon Carbide (SiC) is a kind of low cost, high efficiency processing on plane ceramics. Cutting process was its first step. By carrying out the orthogonal experiment, the research of influence law how three processing parameters such as grinding wheel speed n, pushing-grinding velocity，pushing-grinding depth，affect single particle average grinding force was laid special stress on. On the basis of the traditional empirical formula of grinding force，ternary linear regression analysis was carried out with the least square method (LSM) in Eviwes8.0，then establishing diamond wheel deeply cutting and slowly feeding ceramic average grinding force model, which provides a processing parameter optimization for the above process.