In recent years,new etching technologies emerged,curve structures are designed on silicon electrodes for semiconductor etching.The precision and roughness requirements of curved silicon electrodes are very high，they were produced abroad previously,and the specific process is unknown.An efficient and precise grinding method was developed for curved silicon electrodes.Through the analysis of curved silicon electrode parts,a process scheme of using five axis grinding technology for machining was proposed.Five axis programming software was used for programming,and a five axis grinding center with internal automation technology and digital simulation technology was used to verify the grinding strategy of curved silicon electrodes.The results indicate that this processing technology can improve processing efficiency and product yield,reduce grinding and polishing time,and reduce production costs.