国家重点研发计划(2019YFB1706200)
王晓初,张思华,李晶,周思杰.微流控芯片键合温度控制系统的设计[J].机床与液压,2022,50(6):80-83.
WANG Xiaochu, ZHANG Sihua, LI Jing, ZHOU Sijie. Design of Bonding Temperature Control System for Polymer Microfluidic Chip[J]. Machine Tool & Hydraulics,2022,50(6):80-83